Due to the fact that the technology of domestic LED lighting chips is still far behind that of foreign countries, and the packaging technology is relatively mature, in order to ensure the quality of LED fixed lighting fixtures, the chips must also be imported from abroad and then packaged in Taiwan, South Korea, or China. So, domestic lighting manufacturers need to solve two key issues for LED fixed lighting fixtures, namely heat dissipation and light distribution.

The lifespan and light efficiency of LEDs are closely related to heat dissipation. Poor heat dissipation can seriously affect the lifespan and light efficiency of LEDs. Due to the fact that chips are imported from abroad, it is difficult for lamp manufacturers to control and improve them. Therefore, the heat generated by LED chips must first be dissipated onto the aluminum substrate, and then dissipated onto the lamp housing through the aluminum substrate. So, the ratio of the size of the aluminum substrate to the power of the LED is a very important parameter. The larger the ratio, the larger the size of the aluminum substrate, and the smaller the power, the faster the heat dissipation of the LED. Conversely, the smaller the ratio, the slower the heat dissipation of a high-power LED through a smaller aluminum substrate, and the worse the heat dissipation effect.